A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles

  1. Matallana, A.
  2. Robles, E.
  3. Ibarra, E.
  4. Andreu, J.
  5. Delmonte, N.
  6. Cova, P.
Journal:
Microelectronics Reliability

ISSN: 0026-2714

Year of publication: 2019

Volume: 102

Type: Article

DOI: 10.1016/J.MICROREL.2019.113500 GOOGLE SCHOLAR
Data source: Scopus