A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles

  1. Matallana, A.
  2. Robles, E.
  3. Ibarra, E.
  4. Andreu, J.
  5. Delmonte, N.
  6. Cova, P.
Aldizkaria:
Microelectronics Reliability

ISSN: 0026-2714

Argitalpen urtea: 2019

Alea: 102

Mota: Artikulua

DOI: 10.1016/J.MICROREL.2019.113500 GOOGLE SCHOLAR
Datuen iturria: Scopus