A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles

  1. Matallana, A.
  2. Robles, E.
  3. Ibarra, E.
  4. Andreu, J.
  5. Delmonte, N.
  6. Cova, P.
Revue:
Microelectronics Reliability

ISSN: 0026-2714

Année de publication: 2019

Volumen: 102

Type: Article

DOI: 10.1016/J.MICROREL.2019.113500 GOOGLE SCHOLAR
La source de données: Scopus