A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles

  1. Matallana, A.
  2. Robles, E.
  3. Ibarra, E.
  4. Andreu, J.
  5. Delmonte, N.
  6. Cova, P.
Zeitschrift:
Microelectronics Reliability

ISSN: 0026-2714

Datum der Publikation: 2019

Ausgabe: 102

Art: Artikel

DOI: 10.1016/J.MICROREL.2019.113500 GOOGLE SCHOLAR