Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection

  1. Baïri, A.
  2. Roseiro, L.
  3. Martín-Garín, A.
  4. Adeyeye, K.
  5. Millán-García, J.A.
Aldizkaria:
Microelectronics Reliability

ISSN: 0026-2714

Argitalpen urtea: 2017

Alea: 70

Orrialdeak: 79-83

Mota: Artikulua

DOI: 10.1016/J.MICROREL.2017.01.002 GOOGLE SCHOLAR
Datuen iturria: Scopus