An improved anisotropic wet etching process for the fabrication of silicon MEMS structures using a single etching mask

  1. Pal, P.
  2. Sato, K.
  3. Gosalvez, M. A.
  4. Shikida, M.
Collection de livres:
MEMS 2008: 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST

ISSN: 1084-6999

ISBN: 978-1-4244-1792-6

Année de publication: 2008

Pages: 327-328

Congreso: 21st IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2008)

Type: Communication dans un congrès

GOOGLE SCHOLAR
La source de données: WoS