Transmission electron microscopy of diffusion-soldered Ni/Al/Ni interconnections

  1. Jezierska, E.
  2. López, G.A.
  3. Zieba, P.
Revue:
Materials Chemistry and Physics

ISSN: 0254-0584

Année de publication: 2003

Volumen: 81

Número: 2-3

Pages: 569-572

Type: Communication dans un congrès

DOI: 10.1016/S0254-0584(03)00077-4 GOOGLE SCHOLAR